Neotek has been achieving continuous growth by focusing on strategic positioning in order to meet the enormous product demand and advanced technologies required in the communication and semiconductor market. As a company specializing in HDI mass lamination and packaging, the intermediary products for semiconduc- tor PCB, Neotek is maintaining a leading position based on its production capacity unrivaled by other mass lamination companies in Korea. 

With Simmtech and TLB, Korea’s top two semiconductor PCB makers in Korea, as its key customers, Neotek has established a system to supply products by more than 70% of the demands of these two companies, and is currently promoting customer diversification and expansion. 

By implementing large-scale facility investment each year, Neotek has become the only company in Korea capable of mass-producing DDR-5, which requires the highest difficulty level. As such, Neotek is building potential power to dominate the market in the future.

Information

Address

51, 2 Sunhwan-ro 742-beongil, Heungdeok-gu, Cheongju-si, Chungcheongbuk-do, Korea

Tel

+82-43-272-5652

Fax

Website

http://www.neopcb.com

Products

Printed circuit boards, electronic products

Certifications

ISO 9001, ISO 14001, etc.

Production Facilities

Pretreatment machine, exposure machine, DES, AOI, auto punching machine, oxide, auto lay-up, press line, x-ray, router, chamfer

Ppuri Technologies

Next-generation high-frequency PCB surface treatment process technology

History

2000 Neotek established

2004 Established plant Started SPS mass lamination business

2005 Started out layer-D/F business

2012 Expanded business area to include FVI, VRS B.G.A

2017 Completed smart factory

2020 Established advanced DES facility, expanded production volume

2021 Established full auto layup and high-frequency bonding facilities, expanded automation system

Business Details and Production Items

Package/HDI mass lamination for semiconductor

Features

· Productivity
-HDI - Mass 43 km2 (strength in capacity, L/T)
-SPS - Differentiated press process environment infrastructure
-Excellent production equipment capability (fine pattern, thickness min. 0.04 mm)

· Quality
-HDI, SPS Best Supplier Award
-Quality exchange meeting to reflect customer needs (to improve response to VOC)

Key Products

• Desktop PC, Notebook PC Workstation, Server, etc.
• Build-up MLB
• Server/Desktop/Notebook
• DDR Board
• BGA Substrate
• BGA Substrate

Production Facilities

• High-frequency bonding machine
• Exposure machine
• Lay-up
• 10-layer press